| 摘要 |
The IC chip (20) has a number of terminals provided by at least two groups of metal terminal pads (1-12) , positioned on the upper side or underside of the IC chip, the first group of terminals used for a standard pin layout connections and the second group of terminals used for mirror-image pin layout connections. The IC chip is positioned in two alternate orientations for connection in a standard pin layout or a mirror-image pin layout, e.g. by rotating it about an axis perpendicular to its upper and lower surfaces. |
