MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enhance reliability by a method wherein the need in eliminated for an Ag plate on a lead frame by reducing the cu-based surface layer on the lead frame. CONSTITUTION:A Cu alloy thin plate is pressed or etched into a lead frame 31. The lead frame 31 is heated in a reducing atmosphere for the removal of oxides from the surface thereof. A pellet 32 is bonded to the surface of the lead frame 31. The lead frame 31 is heated for the bonding of an end of an Au wire 35 to an electrode 34 of the pellet 32, which is followed by thermocompression bonding of the other end of the wire 35 onto the surface of Cu or a Cu alloy forming a lead tip 36. The lead frame 31 is resin-potted after the formation of a thin oxide film 39 on the surface thereof in a process wherein the lead frame 31 is exposed to heat resulting from molding.