| 摘要 |
PURPOSE:To supply a low-cost lead frame by forming an Al film on one side of a substrate by vapor deposition and by performing etchibg of the part which need not the Al film in addition to lead frame pattern etching. CONSTITUTION:An Al vapor-deposited film 4 is formed on a substrate 1 and a resist 2 is spread over that. Next, exposure and development are performed through a photomask 3. After that, the vapor deposited film 4 is etched by using the resist 2 as a mask. Next, a second resist film 5 is spread on both sides followed by exposure and development through the mask 6 of a lead frame pattern. After that, the substrate 1 is etched into the lead frame pattern by using the resist 5 as a mask. Then the resist 5 and 2 is removed to form the lead frame comprising the vapor deposition film 4 on the substrate 1. |
