| 摘要 |
Solderability of a solder ball of solder having a high melting temperature to be used as an electrical and mechanical connection means in a ball grid array module, is improved by first removing native oxide from the solder ball (8), and, then, to prevent formation of new oxide on the solder ball, depositing a protective layer (9) of a metal enabling soldering of the solder ball by a conventional soldering paste. |
