发明名称 |
Hermetic single chip integrated circuit package |
摘要 |
An individual integrated circuit package utilizing an intermediate die carrier having legs in contact with a wiring substrate and a compatible lid to effect hermeticity. More specifically, the carrier includes on its outer surface a raised section and a peripheral ledge. The cap is formed with a cutout in its closed extremity to accommodate the raised carrier section and the portions of the cap adjacent the cutout rest upon and are sealed to the carrier ledge. The rim of the cap at its open extremity contacts and is sealed to the substrate to form the completed hermetic package. |
申请公布号 |
US5031025(A) |
申请公布日期 |
1991.07.09 |
申请号 |
US19900481919 |
申请日期 |
1990.02.20 |
申请人 |
UNISYS CORPORATION |
发明人 |
BRAUN, ROBERT E.;GIBBS, RONALD T. |
分类号 |
H01L23/04;H01L23/498 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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