VORRICHTUNG FUER EINE FLUESSIGKEITSKUEHLUNG EINES ELEKTRISCHEN BAUELEMENTES, INSBESONDERE HALBLEITER-BAUELEMENTES.

摘要

The cooling system uses a heat sink (1) in thermal and electrical contact with the semiconductor element, which incorporates at least one cooling channel (2) through which the liquid coolant is passed. The ends of the cooling channel (2) are coupled to supply and return lines (9) via end fittings which are insulated from the heat sink (1) by an insulating layer (6) applied to the channel wall. Pref. the end of each channel (2) has a threaded end section of larger dia. carrying an insulating coating, into which the line end fitting (8) is screwed.