| 摘要 |
<p>PURPOSE:To obtain a laminated substrate having extremely uniform thickness distribution, small inter-layer displacement and high accuracy by interposing a low frictional layer among both-side press plates and a laminated board to be contact-bonded and forming clearance hole shaving necessarily sufficient size larger than the diameter of a locating pin to the press plates. CONSTITUTION:An O ring 3 is arranged to the peripheral sections of an upper press plate 1 and a lower press plate 2 and pressing sections are sealed from the peripheral sections on heating and pressing to confine a molten resin 4, and a slight space 6 is formed between a laminated board 5 and the O ring 3 and the extrusion of an excess resin is permitted. Friction is reduced remarkably through polyimide films 7 coated with oil among the upper press plate 1, the lower press plate 2 and the laminated board 5 while clearance holes 9 permitting the slight positional displacement and movement of locating pins 7 to the upper press plate 1 and the lower press plate 2 as being oppositely faced to laminated-board locating pins 8 are formed, thus conducting contact bonding. Accordingly, the laminated board can freely be expanded and contracted, the thickness distribution of products is equalized, and inter-layer displacement is also reduced.</p> |
