| 摘要 |
PROBLEM TO BE SOLVED: To provide a producing method of IC card by which leaf sheets can be accurately aligned and production efficiency and yield can be improved at low cost. SOLUTION: In the producing method of IC card for sealing an IC chip and the IC unit of an antenna between a first leaf sheet material 2 and a second leaf sheet material 3, the first leaf sheet material 2 is supplied onto a carrier tray to be carried through each process, an inlet sheet material 32 provided with the IC unit is supplied in the next process, the second leaf sheet material 3 is supplied in the next process and further, the first and second sheet materials are overlapped in the next process to seal the IC unit. In this case, sheet defect information showing a defective spot on the first and/or second sheet material is read and the IC unit is not supplied to the defective spot. |
