Chip carrier having through hole conductors

摘要

A chip carrier has an electrically insulating substrate with through holes and a multilayer structure formed on the substrate. The multilayer structure includes an electrical conductor pattern for electrical connection with through hole conductors provided in the through holes and for electrical connection with an IC chip. The through hole conductors have their ends protruding from one surface of the substrate on which registration layers are formed for electrically interconnecting the through hole conductors and the electrical conductor pattern in the multilayer structure. The surface of the protruding end of each of the through hole conductors is generally continuously convexly curved and has a maximum height at or in the vicinity of its central portion with the height being measured from the surface of the substrate.