INSULATING RESIN COMPOSITION FOR COPPER-FOIL LAMINATION-TYPE BUILD-UP AND PRODUCTION OF MULTILAYER PRINTED CIRCUIT BOARD USING THE COMPOSITION

摘要

PURPOSE:To produce a multilayer printed circuit board holding an insulating resin layer having high interlaminar peeling strength and uniform thickness by a simple lamination step at a low cost. CONSTITUTION:An insulating resin composition 4 is applied to both surfaces of a double-face printed circuit board in a state to cover the conductor pattern 3 and the composition is temporarily dried. A copper foil having roughened bonding face is continuously laminated to the circuit board with a hot-press roller, the insulating resin composition 4 is cured by heating and a conductor pattern 8 is formed on the outer copper foil of the obtained multilayer laminated board. The insulating resin composition contains (A) an epoxy resin consisting of a combination of (a) at least one kind of high-softening epoxy resin having a softening point of 50-110 deg.C and (b) at least one kind of low-softening epoxy resin having a softening point of <50 deg.C at a ratio to satisfy the formula X[(softening point of each epoxy resin)X(its mixing ratio)]=30-90, (B) an epoxy resin hardener and (C) a diluent.