| 摘要 |
PURPOSE:To prevent semiconductor chip bonding solder from spreading over a wire bonding area when a wire bonding is performed to a part of a semiconductor package close to a die bonding section. CONSTITUTION:A semiconductor package has such a structure that a first metallized layer 2 is formed on a ceramic substrate 1, an Ni plating layer 5 and an Au plating layer 6 are deposited on the first metallized layer 2, and a signal input/output wire is provided thereon. A second metallized layer 3 is formed in a region surrounded with the first metallized layer 2 to be mounted with a semiconductor chip 8. The second metallized layer 3 is made to serve as a metallized step 4 which prevents die bonding solder 9 from flowing out. |
