| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for correcting a warpage which has occurred. SOLUTION: With a memory module 10 introduced, a surface opposite to a mounting surface of a memory bare chip 1, while being one surface of a module substrate 2, is restrained into a flat state with a restraining plate 15. The restraining plate 15 is restrained by pressing a sealing frame 7, attached near the outside periphery of the module substrate 2 with a claw part 16. While being restrained, a heater 14 is put close to heat the memory module to a specified temperature. After heating, with the restrained state kept, heat is removed to about the room temperature, and after that, the claw part 16 is removed to unlock the restrained state. Thus, the memory module 10 is corrected. |
