Method of bonding a diamond substrate to at least one metal substrate

摘要

The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.