发明名称 |
Abrasive tools for grinding electronic components |
摘要 |
Abrasive tools containing high concentrations of hollow filler materials in a resin bond are suitable for polishing and backgrinding of hard materials, such as ceramic wafers and components requiring a controlled amount of surface defects. These highly porous abrasive tools comprise fine grit abrasive grain, such as diamond abrasive, along with the hollow filler material and resin bond.
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申请公布号 |
US6394888(B1) |
申请公布日期 |
2002.05.28 |
申请号 |
US19990322945 |
申请日期 |
1999.05.28 |
申请人 |
SAINT-GOBAIN ABRASIVE TECHNOLOGY COMPANY |
发明人 |
MATSUMOTO DEAN;WASLASKE WILLIAM F.;SALE BETHANY L. |
分类号 |
B24D3/28;B24D3/00;B24D3/02;B24D3/32;B24D3/34;B24D5/00;B24D5/06;B24D7/00;C09K3/14;H01L21/304;(IPC1-7):B24B33/00 |
主分类号 |
B24D3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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