发明名称 MOLDING METHOD FOR RESIN
摘要 PURPOSE:To obtain a shape, the adhesive property of both the first resin material and the second resin material thereof is excellent, by a method wherein the first resin material is injected into a cavity, into which a pad is charged and molded, the pad is removed and the second resin material is injected and molded. CONSTITUTION:The pad 16 in silicon rubber is charged into the first cavity 15 of the cavity 10 of a molding die 8, a core 9 is combined and the second cavity 17 is formed, and the first resin material is injected into the cavity 17 through a liquid injecting port 14 from a mixing head 4 and molded. The die 8 is opened, the pad 16 is mold-released from the cavity 15, the die 8 is clamped, and the second resin material is injected into the cavity 15 through the injecting port 14 from a mixing head 5 and molded while the both resin materials are bonded integrally.
申请公布号 JPS5715915(A) 申请公布日期 1982.01.27
申请号 JP19800090434 申请日期 1980.07.02
申请人 KANTO SEIKI CO 发明人 OKUDAIRA KINJI;FURUYA NOBUO;HORI SHIYOUJI;IMAI SUMIO
分类号 B29C39/12;B29B7/00;B29C39/00;B29C39/24;B29C39/26;B29C45/16;B29L31/58 主分类号 B29C39/12
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