发明名称 |
A POLYCRYSTAL DIAMOND TOOL |
摘要 |
The present invention provides a diamond sintered compact tool, which is excellent in economy as well as cutting edge strength. A diamond sintered compact cutting tool comprising a diamond sintered compact sintered at an ultra-high pressure and high temperature and a WC-Co type cemented carbide substrate directly bonded to the diamond sintered compact during a step of sintering and brazed to a tool base through the WC-Co type cemented carbide substrate. in which a ratio of the thickness of the WC-Co type cemented carbide substrate to the thickness of the diamond sintered compact layer satisfies the relation of: 0.8 ~ WC-Co type cemented carbide substrate/diamond sintered compact layer ~ 3.0 and the diamond sintered compact layer has a thickness of 0.05 mm to 0.5 mm, preferably 0. 05 mm to 0.45 mm, more preferably 0.12 mm to 0.36 mm. |
申请公布号 |
CA2308684(A1) |
申请公布日期 |
2000.11.18 |
申请号 |
CA20002308684 |
申请日期 |
2000.05.17 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
YOSHIDA, KATSUHITO;SHIRAISHI, JUNICHI;NAKAI, TETSUO |
分类号 |
B23B27/20;B22F7/00;B22F7/06;B23B27/18;C04B37/02;C22C26/00;C23C30/00;(IPC1-7):B24D3/10 |
主分类号 |
B23B27/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|