| 摘要 |
FIELD: microelectronics, in particular, materials, used for making products, working in UHF range such as for example flexible electronic circuit boards, flexible circuit cables, flexible circuit inductiveness coils, capacitors and the like. ^ SUBSTANCE: material has multilayer structure, is made of separate thin films received from same material by similar method of practically even thickness d<80 mcm. ^ EFFECT: improved manufacturability and low values of tangent of angle of dielectric losses. ^ 2 dwg |
