发明名称 Fabrication method for a semiconductor device including a semiconductor substrate formed with a shallow impurity region
摘要 A method of manufacturing a semiconductor device includes forming isolation regions, a gate insulator film and gate electrodes, implanting in the silicon substrate with impurity ions, annealing to recover crystallinity of the implanted silicon substrate without diffusing the impurity ions, depositing an interlayer insulator film on the isolation regions, the silicon substrate, and the gate electrodes, and heating the silicon substrate by irradiating a light having a wavelength that the light is absorbed by the silicon substrate without being absorbed by the interlayer insulator film, activating the impurity ions so as to form source and drain regions.
申请公布号 US7189624(B2) 申请公布日期 2007.03.13
申请号 US20040868016 申请日期 2004.06.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ITO TAKAYUKI
分类号 H01L21/336;H01L21/02;H01L21/265;H01L21/8238;H01L27/092;H01L27/12;H01L29/78;H01L29/786 主分类号 H01L21/336
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