发明名称 MULTILAYERED POLYIMIDE FILM AND ITS FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a multilayered polyimide film having high tensile breaking strength, high tensile elasticity and the coefficient of linear expansion in a low surface direction all together, and excellent in surface adhesiveness, and its manufacturing method. SOLUTION: The multilayered polyimide film is constituted by laminating at least a layer (a) which comprises polyimide represented by a compound 1 having, for example, a 4,4'-oxydiphthalic acid residue as a residue of an aromatic tetracarboxylic acid and 1,3-bis(4-aminophenoxy)benzene as a residue of aromatic diamine, and a layer (b) which comprises polyimide having at least a pyromellitic acid or biphenyltetracarboxylic acid residue as a residue of an aromatic tetracarboxylic acid and diamine or phenyldiamine having a benzoxazole skeleton as a residue of aromatic diamine. The multilayered polyimide film is formed by laminating the layer (a) and the layer (b) at 200°C or lower in a state that residual volatile component ratios of both the layers are 10% or higher. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008044229(A) 申请公布日期 2008.02.28
申请号 JP20060221919 申请日期 2006.08.16
申请人 TOYOBO CO LTD 发明人 YOSHIDA TAKESHI;RI RI;MATSUOKA TAKESHI;MAEDA SATOSHI
分类号 B32B27/34;C08L79/08 主分类号 B32B27/34
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