| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, the manufacturing efficiency of which can be improved and the manufacturing cost reduced, while improving its durability. <P>SOLUTION: The semiconductor device A, equipped with a semiconductor sensor chip 5 in which a diaphragm 5d is formed, is manufactured by using a lead frame. The semiconductor device is formed by providing a stage 1 to which the semiconductor sensor chip 5 is to be fixed; a suspension lead 2 which supports the stage 1; a lead 3; a first sealing resin layer 4 which seals the stage 1, and the suspension lead 2 and the lead 3; a cover 9; and a second sealing resin layer 10 which fixes to the first sealing resin layer 4 covering the cover 9. A through-hole 1c is formed facing a diaphragm 5d in the stage 1; a concave portion 4c communicating with the through-hole 1c is formed in the first sealing resin layer 4; an opening 9i is formed through the cover 9 and an electrical conductive layer 9h, made of an electrical conductive material, is formed on the inner surface of the cover 9; and an electrically continuous electromagnetic shield, consisting of the electrically conductive layer 9h of the cover 9, the suspension lead 2 and the stage 1, surrounds the semiconductor sensor chip 5. <P>COPYRIGHT: (C)2008,JPO&INPIT |
