发明名称 LOOP TYPE HEAT PIPE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a loop type heat pipe capable of ensuring flatness of a surface on a heating component side of an evaporation part even in a case of performing thinning, and having high heat transfer efficiency between the evaporation part and the heating component.SOLUTION: A loop type heat pipe includes: an evaporation part 31 that heats working fluid with heat transmitted from a heating component 35, thereby to generate steam; a condensation part that condenses steam generated in the evaporation part 31; a liquid pipe that communicates between the evaporation part 31 and the condensation part and in which the working fluid in a liquid-phase state circulates; and an evaporation pipe that communicates between the evaporation part 31 and the condensation part and in which the working fluid in a gas-phase state circulates. Also, the evaporation part 31 has a base sheet 51 to which heat is transmitted from the heating component 35 to a one-side surface side, and a cover sheet 52 that has a lower rigidity than the base sheet 51 and is arranged oppositely to the other surface of the base sheet 51.SELECTED DRAWING: Figure 13
申请公布号 JP2016090204(A) 申请公布日期 2016.05.23
申请号 JP20140228965 申请日期 2014.11.11
申请人 FUJITSU LTD 发明人 KOMURO TSUTOMU
分类号 F28D15/02;H01L23/427 主分类号 F28D15/02
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