TEMPORARY BONDING ADHESIVE FOR PROCESSING THIN WAFER AND PREPARATION METHOD THEREOF

摘要

Disclosed in the present invention are a temporary bonding adhesive for processing a thin wafer and a preparation method thereof. Per 100 total parts by weight of the temporary bonding adhesive, the temporary boding adhesive comprises 55 to 70 parts by weight of a solvent and 30 to 45 parts by weight of a base resin dissolved or dispersed in the solvent. The base resin is a high polymer or a high polymer blend having a thermal decomposition temperature above 320˚C and a melt index above 24. The temporary bonding adhesive advantageously has a high thermal stability and a high corrosion resistance; furthermore, bonding/de-bonding of the temporary bonding adhesive is efficient, thus allowing easy cleaning of the residual adhesive layer, and preparation of the temporary bonding adhesive is economical.