发明名称 SUBSTRATE PROCESSING APPARATUS, GAS DISPERSION UNIT, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
摘要 The present invention improves a feature of a film formed on a substrate and improves a manufacturing throughput. A substrate processing device comprises: a processing chamber configured to process the substrate; a substrate placing stand where the substrate is placed; and a gas dispersion unit including a first supply region facing the substrate wherein a first dispersion hole for supplying a first gas and a second dispersion hole for supplying a second gas are installed in the first supply region and a second supply region facing a surface of an outer circumference side rather than the surface of the substrate placing stand where the substrate is placed wherein the second supply region is formed by a larger hole diameter than the second dispersion hole and a third dispersion hole for supplying the second gas is installed in the second supply region.
申请公布号 KR20160086242(A) 申请公布日期 2016.07.19
申请号 KR20150034973 申请日期 2015.03.13
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 SAIDO SHUHEI
分类号 H01L21/02;H01L21/205;H01L21/683;H01L27/108 主分类号 H01L21/02
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