发明名称 CONNECTING STRUCTURE OF LARGE-POWER AND HIGH FREQUENCY TRANSMISSION LINE
摘要 PROBLEM TO BE SOLVED: To reduce the temperature rise of a connecting part through heat radiation by connecting the central conductor of a coaxial connector in a metallic housing with the conductor line of a flat circuit on a heat conducting dielectric substrate. SOLUTION: After connecting a micro strip line 15 with a micro strip pattern 54 with a Au connecting ribbon 59, they are connected with the opposite coaxial plug connector. Heat obtained by connecting the central conductor, which is generated by the transmission of a large-power and high-frequency signal sent from the internal circuit of a metallic housing 25, is conducted to a ceramic dielectric plate 52 being the heat conductive conductor of high heat conductivity via a heat conductive bar conductor 57 from the central conductor 35 of a coaxial connector 27 and a pattern 54, passes through a metallic substrate 55 of similarly high heat conductivity and is transmitted to the housing 25 of a large heat capacity by diffusion and is radiated from the surface. Thus the heat of central conductors connected to the connector 27 is dissipated. A proper heat radiating means or cooling means is added to the housing 25 if necessary.
申请公布号 JP2000349501(A) 申请公布日期 2000.12.15
申请号 JP19990154070 申请日期 1999.06.01
申请人 FUJITSU LTD 发明人 YABE NORIO
分类号 H01P1/04;H01P1/30;H01P3/08;H01P5/08;H01R9/05 主分类号 H01P1/04
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