PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, AND METHOD FOR PROCESSING GLASS SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which allows formation of a resist that can achieve both of sufficient adhesiveness to a glass substrate during etching by a solution containing hydrofluoric acid and peeling property from the glass substrate after etching.SOLUTION: The photosensitive resin composition comprises (A) a binder polymer, (B) a photopolymerizable compound comprising a compound represented by formula (1), and (C) a photopolymerization initiator. The content of the compound of formula (1) is 10 to 60 parts by mass with respect to total 100 parts by mass of the binder polymer, the photopolymerizable compound, and the photopolymerization initiator.SELECTED DRAWING: None