| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, together with its manufacturing method, which shortens the manufacturing time in a mounting process, while requiring no bonding wire. SOLUTION: The rear surface of a pellet 2, where a semiconductor element is formed, is electrically connected to a lead 1b formed of a first lead frame 1, while a ball 2a on the front surface of the pellet 2 is electrically connected to a lead 4a formed of a second lead frame 4, with the pellet 2 mounted with a resin 5. |
