| 摘要 |
PURPOSE:To easily obtain the heat sink of stabilized quality with small number of manhours by a method wherein the insulating layer on an Al main heat sink is formed using prepreg. CONSTITUTION:The surface of the 1,000mm. square Al plate of approximately 10mm. in thickness is roughened using 17mm. glass beads and 200-count alundum, and a processing by phosphate alumite is performed on the above. Glass epoxy prepreg is pressure-bonded by heating on the above at 160 deg.C and 25kg/cm<2>, cut into the prescribed measurements, and the main heat sink 1 is completed. Then, an Al block 3 and an Al angle 4 are adhered to an alumite film 5 using an epoxy bonding agent 6, and a circuit element 2 is mounted and wiring is formed. According to this constitution, the performance of the device is stabilized and its manufacturing process is simplified because the insulating layer 5 has high adhesive strength, stabilized quality and a uniform film thickness. A plate material or an extruding material with a fin may be used as a material for the heat sink. |
