| 摘要 |
The method of mounting consists in depositing, on the substrate (3) carrying the conductive tracks (4), a layer of insulating substance having windows (7) uncovering the regions (5) for connection of the tracks (4). Next, a layer of solder material (8) is deposited at the bottom of the windows. It then only remains to lay the board (1) on the horizontally held substrate (3), the pins (2) engaging in the windows (7), and to melt the solder. The board (1) will then float freely on the solder masses so as to take up an optimal position. After solidification of the solder, there is a perfect electrical and metallic connection between the pins (2) and the conductive tracks (4). <IMAGE>
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