| 摘要 |
Electrical components are (33...37) mounted between two printed wire boards (31,32) with the component leads (40,41) positioned in holes in the boards and soldered to conductor patterns (42,43) on the boards (31,32). The conductor patterns (42,43) extend around the lower edge of each board. The boards and components form a subassembly (10) which is positioned on solder pads (50) on the ceramic substrate (14) of a hybrid thick film circuit (12). The hybrid thick film circuit (12) is heated from below the substrate (14) to cause the solder pads (50) to melt and reflow to the conductor patterns (42,43) on the lower edges of the printed wire boards (31,32). When the solder cools, the subassembly (10) is mechanically and electrically connected to the hybrid thick film circuit (12). |
