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经营范围
发明名称
EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
摘要
申请公布号
JPH0275619(A)
申请公布日期
1990.03.15
申请号
JP19880226458
申请日期
1988.09.12
申请人
SUMITOMO BAKELITE CO LTD
发明人
MOGI NAOKI
分类号
C09K3/10;C08G59/20;C08G59/32;H01L23/29;H01L23/31
主分类号
C09K3/10
代理机构
代理人
主权项
地址
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