| 摘要 |
An electronic socket pin for use with sub-cooled integrated circuit devices. The socket pin design provides lower thermal conductance and electrical signal path resistance than a traditional electronic socket pin. The improved socket pin has a tubular body formed of an electrically conductive material having a low thermal conductance, such as 304 stainless steel. The tubular body is open at one end, and has a first diameter at the open end, for receiving an integrated circuit device signal lead. The remainder of the length of the tubular body has a second diameter which is much narrower than the first diameter. This narrower cross section further reduces the thermal conductance of the electronic socket pin. A contact sleeve having a cylindrical body including radially inwardly extending, resilient, prongs formed into the wall of the sleeve is fitted over the open end of the electronic socket pin. When fitted over the end of the socket pin, which includes several longitudinal slots formed into the wall of the socket pin, the prongs extend through the slots for engaging an inserted signal lead. The prongs are attached to the lower section of sleeve, away from the open end of the electronic socket pin.
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