发明名称 Ground clip apparatus for circuit boards
摘要 A ground clip apparatus is designed to make ground contact between two circuit boards as they are mated together. A standoff member is mounted on one of the boards and a spring clip member is mounted on the other board facing the standoff member. The spring clip member has spring arms which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.
申请公布号 US5984697(A) 申请公布日期 1999.11.16
申请号 US19970984443 申请日期 1997.12.03
申请人 QUALCOMM INCORPORATED;SONY ELECTRONICS INC. 发明人 MORAN, SEAN A.;BERG, ROGER W.
分类号 H01R12/16;H01R12/36;H01R13/24;H05K3/34;H05K3/36;H05K3/40;H05K7/14;H05K9/00;(IPC1-7):H01R4/66 主分类号 H01R12/16
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