| 摘要 |
A system and a method for on-the-fly automatic defect classification (ADC) during semiconductor wafer processing are described. In one embodiment of the system, a light source, e.g. a laser, (21) illuminates a small region of a wafer (22) undergoing inspection. Four evenly distributed dark field detectors, e.g. photomultipliers or CCDs, (26-29) are mounted on the edge of the wafer so that their respective fields of view overlap to form a detection zone. Light scattered in the direction of one or more of the detectors (26-29) is collected and converted into an electrical signal, which is transmitted to an analyzer module (34). The analyzer module (34) serves to detect defects in the wafer and to classify them into distinct defect types. Optionally, the system also includes a bright field detector.
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