| 摘要 |
A method for producing a substrate for use in electronic parts which comprises the steps of: applying on a substrate a curable resin solution comprising an organic solvent and, dissolved or dispersed therein, a curable resin having a ring structure, treating the unwanted part of the curable resin solution which is adhered to at least a part of the perimeter, edge and back portion of the substrate with a cleaning solvent comprising a non-polar solvent and a polar solvent to thereby remove it, and drying the curable resin solution applied on the substrate. The method allows the cleaning in a short time as compared to a conventional method and also leads to the production of a substrate for use in electronic parts being improved in the property of low expansion of the curable resin portion after drying and excellent in the shape of a perpendicular cross section
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