Heat dissipation arrangement for plastic housings for electronic units has increased thermal conductivity area(s) produced during multiple component injection molding or by molding insert

摘要

The heat dissipation arrangement has a housing wall (1) with at least one area of increased thermal conductivity that is produced as a component of heat conducting plastic material during multiple component injection molding or by molding an insert of heat conducting plastic or metal. The heat conducting plastic component has metal powder mixed in with it.