| 摘要 |
In an apparatus for coating substrates with materials, particularly for lacquering Si-wafers (9) with photosensitive material, comprising a treating chamber (1,16) holding a carrier (10) (chuck) for the substrate to be treated and at least one atomizing nozzle (2) generating a spray jet of the coating material, which may be dosed and which is directed towards the substrate, and a propellant gas, additional guiding and, respectively or, processing devices (6) are arranged between the atomizing nozzle or nozzles (2) and the substrate carrier (10) in the treating chamber (1, 16), which devices comprise nozzles or swirl generators charged with compressed gas or compressed gas and a solvent, and/or centrifugal disks, small turbines, or the like, and produce the spray jet directed towards the substrate from the spray mist generated by the atomizing nozzle or nozzles, for additionally influencing and controlling the spray jet and thereby to improve the quality of the material application.
|
