发明名称 |
Z interconnect structure and method |
摘要 |
The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.
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申请公布号 |
US6805280(B2) |
申请公布日期 |
2004.10.19 |
申请号 |
US20020041261 |
申请日期 |
2002.01.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JIMAREZ LISA J.;PIERSON MARK V. |
分类号 |
H05K3/32;H05K3/34;H05K3/46;(IPC1-7):B23K1/20 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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