发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor device which is suitable for improvement in the information storing characteristic of a semiconductor device such as DRAM and SRAM or the like through reduction of a junction leak current resulting from a defect, by processing vacant hole defect remaining in the source-drain diffusing layer. SOLUTION: The method of manufacturing semiconductor device comprises the steps of implanting a dopant to a semiconductor substrate to form a source-drain diffusing layer, and diffusing the dopant within the source-drain diffusing layer with the heat treatment under the acidic gas atmosphere. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005209890(A) 申请公布日期 2005.08.04
申请号 JP20040015022 申请日期 2004.01.23
申请人 ELPIDA MEMORY INC 发明人 OKONOGI KENSUKE;OYU SHIZUNORI
分类号 H01L21/265;H01L21/324;H01L21/336;H01L21/8242;H01L27/108;H01L29/78;(IPC1-7):H01L29/78;H01L21/824 主分类号 H01L21/265
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