| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device comprising an electrode terminal at a fine pitch, wherein it is possible to easily join a gold wire by an ultrasonic jointly using type thermocompression wire bonder, and also to easily test without damaging circuit elements. SOLUTION: An electrode terminal 12 testing a semiconductor integrated circuit is disposed on a scribe lane 13 provided for dividing the semiconductor integrated circuit, and the electrode terminal 12 on this scribe lane 13 is connected to electrode terminals 11a, 11b of the opposing semiconductor integrated circuit by a front layer wiring 15a. COPYRIGHT: (C)2005,JPO&NCIPI
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