| 发明名称 |
Three dimensional packaging and cooling of mixed signal, mixed power density electronic modules |
| 摘要 |
An integrated three dimensional packaging and cooling system for cooling an electronic component system with dissimilar power densities and interfering signals.
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| 申请公布号 |
US7301772(B2) |
申请公布日期 |
2007.11.27 |
| 申请号 |
US20060351660 |
申请日期 |
2006.02.09 |
| 申请人 |
ISOTHERMAL SYSTEMS RESEARCH, INC. |
发明人 |
TILTON DONALD E.;TILTON CHARLES L. |
| 分类号 |
H05K7/20;H01L23/473 |
主分类号 |
H05K7/20 |
| 代理机构 |
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