| 摘要 |
According to an embodiment of a circuit substrate of the present invention, in a circuit substrate provided with a plurality of circuit blocks formed on a single substrate, at least one of the metal patterns connecting the circuit blocks is separated into two sections at some midpoint of wiring, and exposed conductor portions whose end portions are to be bridge-connected through soldering are provided at the end portions in the separated portion of the separated two wiring metal patterns.
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