| 发明名称 |
Integrated circuit package with chip-side signal connections |
| 摘要 |
Embodiments of the present invention include an apparatus, method, and/or system for an integrated circuit package with signal connections on the chip-side of the package structure.
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| 申请公布号 |
US7345359(B2) |
申请公布日期 |
2008.03.18 |
| 申请号 |
US20040795072 |
申请日期 |
2004.03.05 |
| 申请人 |
INTEL CORPORATION |
发明人 |
KIM JOONG-HO;HAN DONG-HO;KIM HYUNJUN;HE JIANGQI |
| 分类号 |
H01L23/02;H01L21/60;H01L23/498;H01L23/538;H01L23/552;H05K1/14 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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