| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve resistance to thermal shock, heat discharge characteristics and reliability of a semiconductor device which encloses a semiconductor element in a resin case. <P>SOLUTION: Heat spreaders 16 and 17 and a heat discharging metal base plate 21 are arranged as a heat circuit board upward and downward of semiconductor chips 1 and 2 mounted on the circuit board 15 respectively, and an insulating oil 10 is enclosed to fill an enclosed plastic case 9 storing the semiconductor chips 1 and 2. The insulating oil 10 has higher heat resistance than a heat generation temperature in driving the semiconductor chips 1 and 2 and is used to mix a moisture absorbent and heat conductive particles having heat conductivity larger than the insulating oil 10. <P>COPYRIGHT: (C)2008,JPO&INPIT |
