| 摘要 |
PROBLEM TO BE SOLVED: To provide a spherical semiconductor packaging wiring board of a structure, where spherical semiconductor materials can be mounted with a required strength and the heat dissipation characteristics of the semiconductor materials are also improved. SOLUTION: A spherical semiconductor packaging wiring board 1 comprises mounting parts 20, which are formed in the vicinity of the main surface 3 of the board 1 and respectively have a plurality of pads 18, spherical semiconductor materials 30, which are mounted on the mounting parts 20 by connecting each bump 34 in the vicinities of the bottoms of the spherical semiconductor materials 30 with each pad 18 on the mounting parts 20 via each solder bump 28, and a filling resin 39, which is formed on the main surface 3 and encircles the semiconductor materials 30. |
