Method for rinsing semiconductor wafer, involves matching minimum time of rinsing duration to reaching of threshold value of concentration of particles of predetermine of magnitude area

摘要

The method involves matching the minimum time of the rinsing duration to the reaching of threshold value of concentration of particles of a predetermine of magnitude area or the concentration of one or multiple preset non-metallic inner species of the surface of semiconductor wafer. The rinsing duration is defined as total of all between the chemical final purification and the packing of the semiconductor wafer for dispatching at the client reclined period.