CHIP ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

摘要

According to an aspect of the present invention, provided are a chip electronic component which sufficiently secures an area of a main body of a magnetic material around a coil pattern unit to reduce a problem of a crack defect or the like which can occur especially when manufacturing a slim and thin chip, and a method for effectively manufacturing the same. The chip electronic component comprises: the main body of a magnetic material; and a coil pattern unit embedded inside the main body of the magnetic material, and including a spiral inner coil unit and a lead-out unit which is connected to an end part of the inner coil unit and is exposed to the outside of the main body of the magnetic material. The thickness of the lead-out unit is thinner than that of the inner coil unit.