发明名称 |
STRIPPING COMPOSITIONS FOR REMOVING PHOTORESISTS FROM SEMICONDUCTOR SUBSTRATES |
摘要 |
This disclosure relates to photoresist stripping compositions containing 1) at least one water soluble polar aprotic organic solvent; 2) at least one alcohol solvent; 3) at least one quaternary ammonium hydroxide; 4) water; 5) at least one copper corrosion inhibitor selected from 6-substituted-2,4-diamino-1,3,5-triazines; and 6) optionally, at least one defoaming surfactant. |
申请公布号 |
WO2016109387(A1) |
申请公布日期 |
2016.07.07 |
申请号 |
WO2015US67592 |
申请日期 |
2015.12.28 |
申请人 |
FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. |
发明人 |
DU, BING;DORY, THOMAS;WOJTCZAK, WILLIAM A. |
分类号 |
G03F7/32 |
主分类号 |
G03F7/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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