| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce manufacturing cost and repair cost and which can achieve downsizing.SOLUTION: The semiconductor device comprises: an electrically insulating substrate 2 on which a semiconductor element 1 is mounted; a control substrate 5 on which an electronic component 7 relevant to the semiconductor element 1 is mounted; a spring terminal 10 for electrically connecting the semiconductor element 1 and the control substrate 5; and a positioning pin 9 for connecting one end of the spring terminal 10 and the control substrate 5. The spring terminal 10 includes an elastic part. The one end of the spring terminal 10 and the control substrate 5 are detachably fastened to each other by the positioning pin 9, and the other end of the spring terminal 10 and the electrically insulating substrate 2 come in contact with each other by elastic deformation of the elastic part of the spring terminal 10. |
