| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily joining without causing precipitation of movable ion, in a three-layer structure sandwiching a glass substrate of silicon-glass-silicon or the like.SOLUTION: A joining method includes making a positive electrode joining surface condition between a sensor chip 1 and a glass substrate 2 in a second positive electrode joining step weaker than a positive electrode joining condition between a silicon tube 3 and the glass substrate 2 in a first positive electrode joining step so as to complete the second positive electrode joining step before movable ion in the glass substrate 2 drawn to the cathode side of the glass substrate 2 in the first positive electrode joining step reaches a joint area between the glass substrate 2 and the silicon tube 3 in the second positive electrode joining step.SELECTED DRAWING: Figure 1 |
