| 摘要 |
PROBLEM TO BE SOLVED: To cope with warping occurring at the time of slicing a semiconductive wafer in need of thinned extremely and expanding a diameter, flat and mirror finish working. SOLUTION: This lapping method uses a double-side lapping machine for lapping both the surfaces of a semiconductive wafer W between upper and lower surface plates rotating respectively, a nipping part 1b provided with a circular arc part 1a conformed with the outer periphery of a semiconductive wafer, and thinner than the thickness of the wafer, and a pair of wafer holders 1 provided with a supporting rod 1c extended from the nipping part 1b. |
